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Intel presents its products in 10nm Lakefield and Ice Lake



Intel presents its products in 10nm Lakefield and Ice Lake


Intel has presented in this CES 2019 the first functional prototypes based on Lakefield and Ice lake, two products made in 10nm that offer us a very interesting technological leap and that we already saw in their presentation a few weeks ago. With the competition of AMD with the future 7nm Intel has had to press the accelerator and although it focuses on the 10nm we have Forevos as a technology that enables CPU components to be mounted on 3D using layers.

From the hand of Lakefield we have one of the smaller PC boards that we have seen, in a reduced size thanks to the system Forevos we have all the necessary components to have a complete PC experience. As we see in the presentation video, we have a design in the same package Hybrid CPU (big.LITTLE) that integrates a CPU Sunny cove Core made in 10nm with low consumption Atom cores. With this design an interesting reduction in consumption is achieved and allows us to mount all the necessary components to have a complete SoC in other layers.

A very interesting product for the mini pc, laptop and any low-power device with reduced size, which also integrates a powerful GPU Gen 11 with a much higher performance than the current Gen 9. Without a doubt one of the most interesting assets of Intel for 2019.

In the same presentation, the platform was announced Ice lake for all types of laptops for 2019, a product that has been delayed since 2016 and that no longer has the option of more cancellations due to fierce competition. In the new Ice Lake we have architecture in 10nm, native support Thunderbolt 3, connectivity Wifi 6, improvements in artificial intelligence and for the graphic section one of the promising GPU Gen 11. We will see how real-world performance is in the Christmas 2019.